ADMANANO, which treated our original techniques, can be mixed organic /inorganic powder directly, and improve the powder properties, e.g. fluidity, filling rate, sinterability, compressibility, and etc. ADMANANO can be used for a wide variety of industrial applications. For examples, it improves physical properties of liquid-epoxy-encapsulation and color master batch having high filler content. It also improves mobility of fibers/powders made of organic/inorganic materials and metal, including glass, carbon, talc, mica, silica, alumina, zirconia, titania, ITO, ceria, barium titanate, zinc oxide, aluminum hydroxide, boron nitride, alumium nitride, silicon nitride, Fe, Ni, Al, Ag, Cu, W, Mo, Ta, alloy of these metal, PTFE, PS, silicone, acryl, and etc. as well as those mixtures such as powder-paints. It can be an additive to control dispersibility of these materials, or to spheroidize of them. You can easily open glass/carbon fiber chopped strands. It also can be used as materials to form nano structure, as sintering agent for ceramic condenser, as lubricant agent for ink , and grinding agent for above organic/inorganic materials and metal powder, inorganic pigment, functional ceramics like BaTiO3, and etc.
It also improves mobility of powders used for Selective Laser Sintering (3D printer) or Thermal Spraying, e.g. metal / ceramic powder, nylon beads, plaster, and etc.. You can easily feed small powders uniformly. Its applications are not limited to these examples. ADMANANO changes charging characteristics of insulator particles, such as glass fiber and PTEF powder, and can lower their triboelectricity.
The antistatic effect of Admanano is different from an ordinal mechanism caused by moisture. It is supposed that nano particle reduced friction force, or that nano particle neutralized charge by shuttling between insulator particle and friction surface such as screw, impeller and container. These fillers treated with ADMANANO is used for structure materials, low-dielectric and low-dielectric loss materials, sliding materials and etc..
- ● Electronic devices
Liquid sealing materials,die-attaches,circuit board materials,and fillers for resist materials
- ● Optical materials
Clear adhesives and substrates,hard coating materials
- ● Resin filling materials and additives
- ● Flow promoting agent for powder